• 晶圆级封装

  • 系统级封装

  • 倒装

  • 基板封装

  • 引线框封装

  • 分立器件

Fan-in (Wafer Level Package)

  • WLSCP

  • eWLCSP

Fan-out (Wafer Level Package)

  • eWLB 300mm / HD 330mm (2D, 2.5D, 3D)

Integrated Passive Devices

  • IPD

Through Silicon Via

  • TSV for CIS

  • TSV for rocessor (in development)

System-in-Package

  • FOWLP SiP

  • Laminate FC SiP

  • Laminate FC + WB SiP

  • SiP Modules

  • Leadframe WB SiP

  • Laminate Stack Die WB SiP

Flip Chip Packages

  • fcFBGA

  • fcBGA

  • fcCuBE

  • Bare die fcPoP

  • Molded Laser fcPoP

  • Flip Chip on Leadframe (FCOL)

  • Molded Interconnect System (MIS)

Substrate Packages

  • PBGA

  • FBGA (Stacked Die)

  • Package-on-Package

  • MEMS

  • LGA

  • Smart Card

Lead Frame Packages

  • QFN

  • DFN

  • QFP

  • SOT

  • SOP

  • DIP

  • Molded Interconnect System (MIS)

Discrete Packages

  • TO

  • SOD

  • SOT

  • FBP

  • DFN

Discrete Products

  • Diodes

  • MOSFET

  • Transistors

  • Rectifier

  • BRT

  • TRIACS

  • TVS

联系我们 千亿国际娱乐 法律声明

版权所有@www.qy8.vip,qy8千亿国际,千亿国际娱乐 保留一切权利 苏ICP备050000051号苏公网安备 32000000000607号

关注qy8千亿国际
微信公众号

Baidu
搜狗